Engineering Division

From Prototype to Connected Product

ISDG, LLC combines hardware layout, embedded systems, firmware, wireless networking, and in-house digital fabrication, so a product can move from idea to testable system without waiting on a dozen separate vendors.

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Printed Circuit Board (PCB) Design

High-reliability schematic capture and multilayer board layout

Schematic & Power Architecture

Component selection, precise power budget calculations, circuit protection (ESD/TVS), and schematics design geared for noise isolation and thermal performance.

Multilayer Layout Routing

From 2-layer utility boards to dense 4, 6, and 8-layer PCBs with impedance-controlled differential routing for high-speed signals (USB, Ethernet, RF feedlines).

Wireless & RF Integrations

Custom PCB antenna feeds, antenna matching networks, and chip-on-board module integration for Bluetooth Low Energy (BLE), Wi-Fi, and sub-GHz radios.

Design for Manufacture (DFM)

Optimization of trace widths, annular rings, via placements, and panelization layouts to ensure high yield assembly at modern pick-and-place domestic and offshore board houses.

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Embedded Systems & Firmware

Fail-safe and low-overhead software written in C, C++20, and Rust

MCU Platforms

Deep expertise with STM32 (ARM Cortex-M), ESP32 (Xtensa/RISC-V), Nordic Semiconductor (nRF52/nRF53 series), AVR, and PIC processors.

RTOS & Event loops

Implementation of lightweight bare-metal loops or multi-threaded environments utilizing FreeRTOS, Zephyr RTOS, or custom micro-schedulers.

Peripherals & Protocols

Custom driver development for peripheral communication (I2C, SPI, UART, CAN, Modbus) and analog data acquisition (ADC/DAC interfaces).

Bootloaders & Secure OTA

Fail-safe, dual-bank over-the-air (OTA) remote update architectures and secure boot routines to preserve long-term operational integrity.

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Additive & Subtractive Digital Fabrication

In-house mechanical fabrication for rapid physical prototyping loops

Additive Manufacturing (3D Printing)

Precision FDM and SLA prints optimized for mechanical enclosure housings, assembly fixtures, and structural parts utilizing standard, engineering-grade, and carbon-fiber composite materials.

Subtractive Manufacturing

Precision CNC milling of acrylics, carbon fiber plates, soft metals (aluminum, brass) and custom laser cutting/engraving of gaskets, panels, stencils, and front-plate interface mounts.

In-house Material Coverage

Standard

PLA, PETG, ABS, ASA, TPU 95A and 90A

Engineering

PC, PA, PPA, high-impact and heat-resistant materials

Reinforced

PLA-CF, PETG-CF, ABS-CF, ASA-CF, PA-CF, PAHT-CF, PET-CF, PPA-CF

Support

PLA/PETG breakaway support, Support W, Support G, PVA

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End-to-End System Integration

Unifying hardware, firmware, edge nodes, and cloud backends

Enclosure Design

Designing physical housings in CAD that accommodate the custom PCB assembly, battery layouts, ports, and internal brackets.

Gateway Deployment

Deploying edge gateway nodes (running embedded Linux/Yocto) that aggregate local wireless device data and route it securely downstream.

Kalos Backend Link

Writing and configuring ADL schemas on the server side to receive, validate, and store incoming sensor and event telemetry into SQL databases.

Companion Interfaces

Developing Web Console panels (built on Preact) or companion mobile apps to configure, monitor, and provision hardware in the field.

Have an engineering build in mind?

Tell us about the device, firmware application, or physical prototype problem you are working on.

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